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Saturday, March 27, 1858.+-

Lincoln, IL and Springfield, IL.

Lincoln and Goodrich represent defendants in Bruner et al. v. Bruner et al., bill to correct mortgage deed. Report submitted is approved and ordered recorded. Record.

In Springfield, Lincoln finds among his mail letter from Jonathan Haines of Pekin, client in reaper patent litigation, and one from Alfred Hyde, convict. He writes to Haines about two law suits, one pending, another prospective. "I really can not find time to prepare such a suit, until the Spring courts are over." Abraham Lincoln to Jonathan Haines, 27 March 1858, CW, 2:436-37.

Hyde reminds Lincoln of seeing him on train March 4, 1857, and asks his assistance in seeking pardon. Lincoln files Hyde's letter until Aug., when he writes Daniel Dickinson of New York about him. Hyde to Lincoln, 25 March 1858, Abraham Lincoln Papers, Library of Congress, Washington, DC; Abraham Lincoln to Daniel S. Dickinson, 3 August 1858, CW, 2:535.