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February 23, 1852

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Monday, February 23, 1852.
 Springfield, IL.

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Lincoln writes praecipe and signs bond for costs in William C. Lumsden v. George L. Lumsden, debt case for Sangamon Circuit Court. Herndon-Weik Collection, Library of Congress, Washington, DC. 

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         <dateline>
            <date value='1852-02-23'>Monday, February 23, 1852.</date>
            <place key='39.8000, -89.6333' teiForm='name'>Springfield, IL</place>.
</dateline>
         <p>
Lincoln writes praecipe and signs bond for costs in <name type='case' key='L03921'>William C. Lumsden v. George L. Lumsden</name>, debt case for Sangamon Circuit Court.
<bibl default='NO'>Herndon-Weik Collection, Library of Congress, Washington, DC.</bibl>
         </p>
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